Intel, Qorvo Deliver Multichip Prototypes to BAE Systems for Weapons System Integration
BAE Systems will equip a weapons system with two multichip prototypes that Intel and Qorvo developed under the Department of Defense’s State-of-the-Art Heterogeneous Integrated Packaging program. Intel’s Multi-Chip Package for the digital aspect of the program and Qorvo’s Multi-Chip Module for SHIP’s radio frequency portion were delivered on Thursday to BAE Systems’ facility in Falls […]
